・Recently, issues such as “heat buildup” and “insufficient cooling” have rapidly increased inside ultra-thin smart devices, automotive units, and wearable equipment.

・Some materials achieve extremely low thermal conductivity at thicknesses of only 0.1–0.5 mm, making them ideal for blocking heat in narrow gaps.

・Although these thin-film insulation materials are highly effective for heat control in tight spaces, many are supplied only as single sheets, making them difficult to implement during assembly.

・The industry is developing ultra-thin insulation sheets made from nanoporous materials and aerogels, achieving both space savings and high insulation performance for compact electronics.

・New materials that conduct electricity while blocking heat are also under research, attracting attention in fields requiring both electrical insulation and thermal blocking, such as high-voltage electronic components.

・Globally, composite insulation materials that combine heat suppression with vibration resistance and electrical insulation are steadily entering the market.

We solve the challenges of “difficult to apply” and “not mass-production-ready” with the following technologies:

Challenge	Our Solution
Thin and high-performance materials are hard to introduce with manual application	Lamination + reel-to-reel supply to enable automated mounting lines
Cleanliness and foreign-particle control are required	Dust-controlled pouch processing and ultra-thin double-sided tape (5 μm)

These solutions make it possible to introduce additional thermal countermeasures even in sites where design changes are difficult.

・Major heat problems appear after product launch

・Designs that were fine at the design stage but later face physical constraints due to thin housings or component layout

・Medical, automotive, and industrial equipment that must comply with cleanliness and safety standards

Even if insulation materials have excellent performance, they are often rejected due to “poor usability.”
By converting shapes and supply formats, OTIS enables material manufacturers to:

・Lower adoption barriers and promote wider use

・Standardize products by application

・Expand proposal options and strengthen sales capabilities

・Add value by laminating with other materials

Without prototype samples, materials alone are rarely considered for adoption.

It is becoming increasingly difficult to complete all thermal countermeasures only at the product design stage.
Converting ultra-thin, high-performance insulation materials into usable forms—
this is a new proposal for designers facing “no design changes allowed” and “sudden temperature problems.”

・For technical consultation, contact us (Attention: Kakumoto welcome)

・We also welcome requests for customer-supplied materials and co-development

 

Column Supervisor:

Koji Kakumoto
OTIS Corporation

After studying abroad for language training and gaining experience in planning and product development at a trading company, I joined OTIS Corporation in 2011.
I have mainly worked in corporate planning while also overseeing manufacturing and engineering functions. Since 2018, I have served as President and CEO, focusing on business growth and organizational strengthening.