As electronic devices become smaller and more powerful, heat generated by chips and batteries increasingly becomes the bottleneck for product life and reliability.

If heat is not properly controlled, it can lead to:

・Reduced performance due to thermal throttling

・Degradation of semiconductors, adhesives, and insulation failure

・Malfunctions and warranty risks in automotive and medical devices

・Emergency shutdowns to prevent thermal runaway (thermal shutdown)

These are not just minor defects—they can result in loss of trust and costly recalls.

High-performance thermal conductive sheets (such as graphite sheets and high-thermal-conductivity films) play key roles:

・Spreading heat from hot spots to prevent local overheating

・Reducing thermal resistance for efficient heat dissipation

・Enabling installation in confined spaces and curved surfaces thanks to their thinness and flexibility

 

However, off-the-shelf sheets also have limitations:

・Poor through-plane (thickness-direction) conductivity, leading to weak contact with heat sinks

・Sheet-only supply formats that are unsuitable for mass production or automated mounting

OTIS solves this “hard-to-use” problem with the following solutions:

・Multilayer Processing:
Laminating multiple graphite sheets together with insulation and adhesive layers to achieve both heat spreading and thickness control

・Reel-to-Reel Supply for Automation:
Supporting complex shapes and tight pitches that are difficult to apply manually, enabling automated mass production

・Dust-Control Pouch Processing (e.g., 5-micron thickness):
Contamination-controlled specifications suitable for electronics, cleanroom production, and medical devices

These solutions make it possible to implement after-the-fact thermal countermeasures, even when the original design cannot be changed.

OTIS adds value in situations such as:

・Product temperatures exceeding limits after market release

・Development phases where component layout cannot be changed

・Post-design stages where heat sinks or space constraints must remain unchanged

・Critical thermal applications such as power circuits, communications equipment, and EV power control systems

In such cases, “switchable materials” must be supplied in formats that are easy to adopt and backed by proven results.

By converting materials into concrete, usable shapes:

・Development & Design:
Lowers the barrier for customer design teams during urgent prototyping or mass-production consideration

・Production Engineering & Manufacturing:
Enables standardized shapes compatible with automated placement machines

・Quality Assurance:
Expands proposal options through pouch processing and contamination-control specifications

As a result, OTIS becomes a partner that enhances the marketability of your materials.

Even if thermal issues are discovered after design is finished,
by converting thermal sheets into forms that can actually be used on the production floor,
you can restore reliability without changing the release schedule.

・For technical consultation, contact us (Attention: Kakumoto welcome)

・We also welcome requests for customer-supplied material processing and co-development

 

Column Supervisor:

Koji Kakumoto
OTIS Corporation

After studying abroad for language training and gaining experience in planning and product development at a trading company, I joined OTIS Corporation in 2011.
I have mainly worked in corporate planning while also overseeing manufacturing and engineering functions. Since 2018, I have served as President and CEO, focusing on business growth and organizational strengthening.