We provide information on market trends and technologies related to Otis Corporation, a film and tape processing company.

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• Industory

2026.11.09

6-10. Assembly Process

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• Semiconductors
• Dicing Tape
• Back-End Process
• Die Bonding
• Reflow Soldering
• Semiconductor Packaging
• Wire Bonding

2026.08.05

4-12. Assembly

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• Semiconductors
• Back-End Process
• Die Bonding
• Flip Chip
• Semiconductor Assembly
• Semiconductor Manufacturing Process
• Wire Bonding