We provide information on market trends and technologies related to Otis Corporation, a film and tape processing company.

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• Industory

2026.11.10

7-9. Electro-Thermal Coupling Evaluation

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• Semiconductors
• Electro-Thermal Analysis
• Heat Density
• Inspection and Characterization
• Joule Heating
• Thermal Management
• Thermal Simulation

2026.11.09

5-12. Characteristics of AI Chip Processes (High Current, High Density, High Heat)

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• AI Chips
• HBM (High Bandwidth Memory)
• Semiconductors
• Advanced Process Nodes
• AI Accelerators
• Heat Density
• High-Density Packaging