We provide information on market trends and technologies related to Otis Corporation, a film and tape processing company.

• ALL
• Industory

2026.11.13

Chapter 6: Microfabrication and Heat Problems ― Making the Last 1 mm of Heat Work
6-1. Why Miniaturization Makes Heat Problems More Difficult ― The Smaller Things Get, the Harder It Is for Heat to Escape, and the Larger Tiny Errors Become ―

Electronic devices, semiconductors, batteries, robots, and medical devices are b... Read More

• IC Packages
• Heat
• Heat Density
• High-Density Packaging
• Surface Roughness
• Miniaturization
• Microfabrication

2026.11.12

1-5. What Is Contact Thermal Resistance? ― What Stops Future Industries May Be Not “Material Performance” but “Tiny Gaps” ―

Last time, we established that thermal resistance is how hard it is for heat to ... Read More

• Heat
• Thermal Interface Materials (TIM)
• Thermal Management
• Thermal Resistance
• Air Layers
• Contact Thermal Resistance
• Surface Roughness