2026.11.09

6-7. Package Innovation in the Era of HBM / Chiplets

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• Chiplets
• AI Chips
• HBM (High Bandwidth Memory)
• Semiconductors
• Advanced Packaging
• CoWoS
• Semiconductor Packaging

2026.11.09

5-15. Future Outlook and Challenges for Leading-Edge Processes

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• Chiplets
• Semiconductors
• Advanced Process Nodes
• EUV Lithography
• Post-Moore Era
• Semiconductor Industry Trends
• Semiconductor Scaling

2026.11.09

5-6. Chiplets and 2.5D / 3D Packaging Technologies

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• 3D Packaging
• Chiplets
• Semiconductors
• 2.5D Packaging
• Advanced Packaging
• Advanced Process Nodes
• UCIe