2026.11.12

0-4. 3D Semiconductors Lose Their Escape Routes for Heat ― Future AI Chips Will Have to Fight the “Heat Confinement Problem” ―

With the evolution of AI, semiconductors are rapidly becoming more powerful. Be... Read More

• 3D Packaging
• TSV (Through-Silicon Via)
• Heat
• Advanced Packaging
• 3D Stacking
• Semiconductor Scaling
• Heat Spreading

2026.11.10

[Semiconductor Series] Vol.4/4 ― The Future of Semiconductors and Research Challenges | What Lies Beyond Moore’s Law?

As transistors approach the atomic level, performance improvements through scali... Read More

• AI Chips
• Next-Generation Semiconductor Devices
• Semiconductors
• Advanced Packaging
• Moore's Law
• Post-Moore Era
• Quantum Computing

2026.11.10

10-5. The Evolution of Advanced Packaging Technology

For many years, improvements in semiconductor performance have been achieved thr... Read More

• 3D Packaging
• Next-Generation Semiconductor Devices
• Semiconductors
• 2.5D Packaging
• Advanced Packaging
• CoWoS
• Hybrid Bonding

2026.11.10

10-4. The Emergence of Chiplet Architecture

For many years, the evolution of semiconductors has followed the concept of the ... Read More

• Chiplets
• Next-Generation Semiconductor Devices
• Semiconductors
• 2.5D Packaging
• Advanced Packaging
• System on Chip (SoC)
• UCIe

2026.11.09

6-14. Summary and Review of Learning Objectives (Chapter 6 Review)

... Read More

• Chiplets
• HBM (High Bandwidth Memory)
• Semiconductors
• Advanced Packaging
• Back-End Process
• Next-Generation Packaging
• Semiconductor Packaging

2026.11.09

6-11. The Relationship Between Advanced Packaging and AI Chips

... Read More

• AI Chips
• HBM (High Bandwidth Memory)
• Semiconductors
• Advanced Packaging
• AI Servers
• CoWoS
• Semiconductor Packaging