blog(EN) | OTIS provides solutions for press and lamination in your film and tape production (OTIS)

TECH COLUMN TECH COLUMN

We provide information on market trends and technologies related to Otis Corporation, a film and tape processing company.

ALL
Industory

8-2. Heat Problems in Semiconductor Manufacturing Equipment (Part 1) ― In Semiconductor Manufacturing, “Moving Temperature” Destroys Accuracy More Than “Being Hot” ―

2026.11.13

8-2. Heat Problems in Semiconductor Manufacturing Equipment (Part 1) ― In Semiconductor Manufacturing, “Moving Temperature” Destroys Accuracy More Than “Being Hot” ―

Heat problems are extremely important in semiconductor manufacturing equipment. ... Read More

Chapter 8: Industry Applications ― How Do Heat Problems Appear in Growth Industries?<br>8-1. Heat Problems in AI Servers (Part 2) ― The AI Performance Race Is Also a Race over “How Much Heat Can Be Handled” ―

2026.11.13

Chapter 8: Industry Applications ― How Do Heat Problems Appear in Growth Industries?
8-1. Heat Problems in AI Servers (Part 2) ― The AI Performance Race Is Also a Race over “How Much Heat Can Be Handled” ―

In Part 1, we looked at why GPUs and HBM generate so much heat, how that heat is... Read More

Chapter 8: Industry Applications ― How Do Heat Problems Appear in Growth Industries?<br>8-1. Heat Problems in AI Servers (Part 1) ― The AI Performance Race Is Also a Race over “How Much Heat Can Be Handled” ―

2026.11.13

Chapter 8: Industry Applications ― How Do Heat Problems Appear in Growth Industries?
8-1. Heat Problems in AI Servers (Part 1) ― The AI Performance Race Is Also a Race over “How Much Heat Can Be Handled” ―

AI servers perform huge amounts of computation in a short time. GPUs. CPUs. H... Read More

7-7. From Discarding Heat to Reusing It ― Waste Heat Is Not “Something Unnecessary,” but Can Become an Energy Resource Depending on How It Is Used ―

2026.11.13

7-7. From Discarding Heat to Reusing It ― Waste Heat Is Not “Something Unnecessary,” but Can Become an Energy Resource Depending on How It Is Used ―

Until now, thermal management has centered on how to discard heat. Sending it o... Read More

7-6. Thermal Management for 3D Integration (Part 2) ― The More Semiconductors Are Stacked, the Harder the “Path for Getting Heat Out” Becomes ―

2026.11.13

7-6. Thermal Management for 3D Integration (Part 2) ― The More Semiconductors Are Stacked, the Harder the “Path for Getting Heat Out” Becomes ―

In Part 1, we looked at the structural problem that 3D integration crowds heat s... Read More

7-6. Thermal Management for 3D Integration (Part 1) ― The More Semiconductors Are Stacked, the Harder the “Path for Getting Heat Out” Becomes ―

2026.11.13

7-6. Thermal Management for 3D Integration (Part 1) ― The More Semiconductors Are Stacked, the Harder the “Path for Getting Heat Out” Becomes ―

Miniaturization is not the only way to improve semiconductor performance. Multi... Read More

CONTACT

Okayama

+81-867-42-3690

Tokyo

+813-6810-4830

Contact