Main Characteristics

 • Base material: Polyimide film (typically 25–50 μm thick)

 • Adhesive: Silicone-based or acrylic-based (heat-resistant grades)

 • Features: High heat resistance, excellent insulation, chemical resistance, and flexibility

Under general specifications, polyimide tape can withstand short-term exposure above 260°C and continuous use around 200°C.
For this reason, it is widely used in applications such as PCB protection, metal masking, heater insulation, and reflow processes.

Issue	Typical Causes
Adhesive residue	Adhesive degradation at high temperatures / Improper peel angle / Insufficient bonding pressure
Deformation during heating	Material shrinkage combined with excessive peel stress / Air trapped during lamination
Film warping	Difference in thermal shrinkage rates between adhesive and base film / Poor heating sequence
Easy peeling	Mismatch in surface roughness / Compatibility issues with silicone adhesives

Even when a tape is labeled “260°C compatible,” actual performance can vary significantly depending on processing conditions and design.

Absorbing Lamination Distortion Through Mold and Shape Design

 • Shapes are modified with relief structures to account for the thermal expansion and contraction of polyimide

 • Peel angles and peel structures are carefully designed to prevent stress concentration at the adhesive interface

 

Processing and Inspection in a Constant-Temperature Environment

 • Polyimide tape can expand or contract by several to tens of microns at room temperature, so all processing and measurement are conducted under temperature-controlled conditions

 • Full inspection for misalignment, overflow, and adhesive residue using AOI and high-magnification microscopes

 

Optimized Liner Selection and Lamination Sequence by Adhesive Type

 • Compatible with both silicone-based and acrylic-based adhesives

 • Ensuring reproducibility through proposals that include lamination order, bonding pressure, and heating timing

A request from an electronic component manufacturer:

“Adhesive residue from polyimide tape is causing NG results during inspection. We want to improve yield.”

 

OTIS Implemented the Following Measures:

 • Redesigned molds to match adhesive characteristics

 • Reconstructed bonding and peeling processes, reducing peel stress by more than 50%

 • Conducted all processing and inspection in a constant-temperature cleanroom

 • Designed delivery specifications compatible with automated taping machines

 • Performed transportation tests to overseas manufacturing sites

Result: Defect rate reduced from 10% to 0.2%, enabling transition to mass production.

At first glance, polyimide tapes may all appear similar.
In reality, however, differences in material properties, adhesive behavior, thermal response, and peeling characteristics have a major impact on final results.

 

At OTIS, we provide technical support that focuses not on the tape alone, but on final accuracy and reproducibility, through:

 • Deep understanding of tape material properties

 • Shape and mold design tailored to each material

 • Processing precision down to ±0.01 mm

 • Fully integrated in-house capabilities covering molds, equipment, and inspection

 • Adhesive residue or peeling issues at high temperatures

 • Yield instability due to misalignment

 • Consultation on mold design for complex lamination shapes

 • Supplying tape materials while outsourcing processing only

If any of these apply, please feel free to consult directly with our engineers.

 

 

Koji Kakumoto
OTIS Corporation

After studying abroad for language training and gaining experience in planning and product development at a trading company, I joined OTIS Corporation in 2011.
I have worked primarily in corporate planning while also being involved in manufacturing and engineering operations. Since 2018, I have served as President and CEO, focusing on driving business growth and strengthening the organization.

 

This article is intended for educational and informational purposes only and does not refer to or endorse any specific company, product, or proprietary technology.