2026.11.09

5-9. Advanced Deposition Technologies (ALD / PEALD / Precision CVD)

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• Semiconductors
• Advanced Process Nodes
• ALD (Atomic Layer Deposition)
• Conformal Deposition
• CVD (Chemical Vapor Deposition)
• Gate Dielectric
• Thin Film Deposition

2026.11.09

5-8. Advanced Etching Technologies (High Aspect Ratio / DLE / ALE)

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• Semiconductors
• Advanced Process Nodes
• Atomic Layer Etching (ALE)
• Front-End Process
• High Aspect Ratio Etching
• Plasma Etching
• Semiconductor Equipment Technology

2026.11.09

5-7. Low-k / Ultra Low-k Materials and Multilayer Interconnect Technology

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• Semiconductors
• Low-k Dielectrics
• Advanced Process Nodes
• Copper Interconnects
• Front-End Process
• Multilayer Interconnects
• RC Delay

2026.11.09

5-6. Chiplets and 2.5D / 3D Packaging Technologies

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• 3D Packaging
• Chiplets
• Semiconductors
• 2.5D Packaging
• Advanced Packaging
• Advanced Process Nodes
• UCIe

2026.11.09

5-5. 3D Structuring Technologies (TSV / 3D NAND / 3D DRAM)

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• NAND Flash
• Semiconductors
• TSV (Through-Silicon Via)
• 3D Integration
• 3D Stacking
• Advanced Process Nodes
• Hybrid Bonding

2026.11.09

5-4. Advancing EUV Lithography (High NA EUV)

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• Semiconductors
• Advanced Process Nodes
• ASML
• EUV Lithography
• High-NA EUV
• Lithography
• Lithography Equipment