2026.11.09

Chapter 6: Semiconductor Packaging Technology
6-1. Wire Bonding Technology

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• IC Packages
• Semiconductors
• Back-End Process
• Copper Wire Bonding
• Semiconductor Assembly
• Semiconductor Packaging
• Wire Bonding

2026.08.05

4-12. Assembly

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• Semiconductors
• Back-End Process
• Die Bonding
• Flip Chip
• Semiconductor Assembly
• Semiconductor Manufacturing Process
• Wire Bonding

2026.08.05

4-11. Packaging Technology

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• IC Packages
• Semiconductors
• Advanced Packaging
• Back-End Process
• Semiconductor Manufacturing Process
• Semiconductor Packaging

2026.08.05

4-10. Dicing (Chip Cutting)

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• Semiconductors
• Dicing Tape
• Back-End Process
• Laser Dicing
• Precision Processing
• Semiconductor Manufacturing Process
• Wafer Dicing

2026.07.31

4. An Overview of the Manufacturing Process
4-1. An Overview of the Semiconductor Manufacturing Process Flow

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• Semiconductors
• Back-End Process
• FEOL and BEOL
• Front-End Process
• Process Flow Overview
• Semiconductor Manufacturing Process
• Wafer Fabrication