2026.11.10

7-12. Reliability Evaluation

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• Semiconductors
• Accelerated Life Testing
• Inspection and Characterization
• JEDEC Standards
• Reliability Testing
• Semiconductor Quality Control
• Thermal Cycling Test

2026.11.10

7-10. Burn-in and Lifetime Testing (Burn-in & Lifetime Testing)

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• Semiconductors
• Burn-In Test
• Final Test
• Inspection and Characterization
• Lifetime Testing
• Reliability Testing
• Thermal Cycling Test

2026.11.10

7-6. Failure Analysis (FA)

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• Semiconductors
• Defect Analysis
• Inspection and Characterization
• Reliability Testing
• Root Cause Analysis
• SEM / TEM Analysis
• Semiconductor Failure Analysis

2026.11.09

6-9. Underfill and Molding Materials

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• IC Packages
• Semiconductors
• Flip Chip
• Mold Compounds
• Reliability Testing
• Semiconductor Packaging
• Underfill

2026.11.09

6-6. Package Reliability

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• Semiconductors
• Reliability Testing
• Semiconductor Packaging
• Solder Joint Reliability
• Thermal Cycling Test
• Thermal Stress
• Warpage Control

2026.11.09

5-13. Reliability Engineering

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• Semiconductors
• Advanced Process Nodes
• Copper Interconnects
• Electromigration
• Gate Dielectric
• Reliability Testing