2026.11.09

6-11. The Relationship Between Advanced Packaging and AI Chips

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• AI Chips
• HBM (High Bandwidth Memory)
• Semiconductors
• Advanced Packaging
• AI Servers
• CoWoS
• Semiconductor Packaging

2026.11.09

6-10. Assembly Process

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• Semiconductors
• Dicing Tape
• Back-End Process
• Die Bonding
• Reflow Soldering
• Semiconductor Packaging
• Wire Bonding

2026.11.09

6-9. Underfill and Molding Materials

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• IC Packages
• Semiconductors
• Flip Chip
• Mold Compounds
• Reliability Testing
• Semiconductor Packaging
• Underfill

2026.11.09

6-8. Package Substrate Technology

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• Semiconductors
• ABF (Ajinomoto Build-up Film)
• Package Substrates
• Build-Up Substrates
• Glass Substrates
• Semiconductor Assembly
• Semiconductor Packaging

2026.11.09

6-7. Package Innovation in the Era of HBM / Chiplets

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• Chiplets
• AI Chips
• HBM (High Bandwidth Memory)
• Semiconductors
• Advanced Packaging
• CoWoS
• Semiconductor Packaging

2026.11.09

6-6. Package Reliability

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• Semiconductors
• Reliability Testing
• Semiconductor Packaging
• Solder Joint Reliability
• Thermal Cycling Test
• Thermal Stress
• Warpage Control