2026.11.09

6-5. Electromagnetic Characteristics (SI / PI / EMI) and Package Design

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• Semiconductors
• EMI Shielding
• EMC
• High-Speed Signal Design
• Noise Suppression
• Semiconductor Packaging
• Signal and Power Integrity (SI/PI)

2026.11.09

6-4. Thermal Management

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• Heat Spreaders
• Semiconductors
• Thermal Interface Materials (TIM)
• Heat Dissipation
• Semiconductor Packaging
• Thermal Design
• Thermal Management

2026.11.09

6-3. Fan-out / Fan-in Packaging Technology (WLP / FO-WLP)

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• IC Packages
• Semiconductors
• Advanced Packaging
• Fan-Out Wafer-Level Packaging (FOWLP)
• Next-Generation Packaging
• Redistribution Layer (RDL)
• Semiconductor Packaging

2026.11.09

6-2. Flip Chip Packaging Technology

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• IC Packages
• Semiconductors
• Back-End Process
• Flip Chip
• Semiconductor Packaging
• Solder Bumps
• Underfill

2026.11.09

Chapter 6: Semiconductor Packaging Technology
6-1. Wire Bonding Technology

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• IC Packages
• Semiconductors
• Back-End Process
• Copper Wire Bonding
• Semiconductor Assembly
• Semiconductor Packaging
• Wire Bonding

2026.11.09

5-15. Future Outlook and Challenges for Leading-Edge Processes

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• Chiplets
• Semiconductors
• Advanced Process Nodes
• EUV Lithography
• Post-Moore Era
• Semiconductor Industry Trends
• Semiconductor Scaling