2026.11.10

7-10. Burn-in and Lifetime Testing (Burn-in & Lifetime Testing)

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• Semiconductors
• Burn-In Test
• Final Test
• Inspection and Characterization
• Lifetime Testing
• Reliability Testing
• Thermal Cycling Test

2026.11.10

7-9. Electro-Thermal Coupling Evaluation

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• Semiconductors
• Electro-Thermal Analysis
• Heat Density
• Inspection and Characterization
• Joule Heating
• Thermal Management
• Thermal Simulation

2026.11.10

7-8. Signal and Power Noise Analysis (SI / PI)

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• Semiconductors
• EMC
• High-Speed Signal Design
• Inspection and Characterization
• Noise Suppression
• Semiconductor Characterization
• Signal and Power Integrity (SI/PI)

2026.11.10

7-7. Electrical Characterization (DC / RF / High-Speed Signals)

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• Semiconductors
• Final Test
• Inspection and Characterization
• Parametric Testing
• RF Measurement
• Semiconductor Characterization
• Signal and Power Integrity (SI/PI)

2026.11.10

7-6. Failure Analysis (FA)

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• Semiconductors
• Defect Analysis
• Inspection and Characterization
• Reliability Testing
• Root Cause Analysis
• SEM / TEM Analysis
• Semiconductor Failure Analysis

2026.11.10

7-5. Non-Destructive Inspection (X-ray / SAT / CT)

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• Semiconductors
• Automated Optical Inspection (AOI)
• Inspection and Characterization
• Scanning Acoustic Microscopy (SAT)
• Semiconductor Failure Analysis
• Semiconductor Testing
• X-ray Inspection